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Printing Equipment for Printed Electronics 2014-2025

Published: Apr 2015 | No Of Pages: 203 | Published By: IDTechEx
The unique report addresses the applications and technologies of printing, curing and key integration equipment that is enabling printed electronics. The report assesses the performance of each printing and curing technology type, providing for each:  
 
  • Assessment of capability and suitability to printing different types of materials 
  • Analysis of existing uses of the printing technology in printed electronics 
  • Trends and opportunities for the printing technologies 
  • Leading suppliers and company profiles   
 
This is assessed for the following printing and printed related manufacturing technologies:  
 
  • Screen printing 
  • Inkjet printing 
  • Flexo printing (and offset) 
  • Gravure printing (and offset) 
  • Nano imprinting/embossing
  • Transfer printing Coating systems (Slot die and alternatives)  
The following post-printing processes are also covered, including   
 
  • Thermal drying 
  • IR and UV curing 
  • Photonic curing  
In addition, we cover companies working on equipment integration, manufacturing centers and government funded printed electronics initiatives and manufacturing centers.
1. EXECUTIVE SUMMARY AND CONCLUSIONS
1.1. Comparison of Printing Technologies
1.1.1. Output performance comparison
1.1.2. Running performance comparison
1.1.3. Printing Type by Application
1.1.4. Value chain for equipment for printed electronics
1.1.5. Profitability
1.1.6. Opportunities - Component Attach
 
2. INTRODUCTION
2.1. What is printed electronics
2.2. Why printing?
2.3. Types of Printed electronics technologies/components
2.4. Market size of printed electronics 2014-2025
2.5. Printing Technologies
 
3. PRINTED ELECTRONICS MARKET
3.1. Crystalline Silicon Photovoltaics
3.2. Thin Film Photovoltaics
3.3. Touch screens
3.4. Logic and memory
3.5. OLED displays and lighting
3.6. Smart Packaging
3.7. Transparent Conductive Films
3.8. Direct Printing
 
4. SCREEN PRINTING
4.1. Introduction
4.2. Suitability to different devices/ components
4.3. Existing uses
4.4. Future uses
4.5. Innovation and technical progress
4.5.1. Resolution
4.5.2. Print on print (Double print)
4.6. Company profiles
4.6.1. A&M Kinzel Siebdruckmaschinen Ltd
4.6.2. Applied Materials Baccini
4.6.3. Asada Mesh
4.6.4. DEK Printing Machines Ltd
4.6.5. Dynamesh
4.6.6. Ever Bright Printing Machine Fty. Ltd
4.6.7. KIWO
4.6.8. Metal Etch Services Inc
4.6.9. p-tec GmbH
4.6.10. Saati Americas Corp
4.6.11. Sefar
4.6.12. Spartanics
4.6.13. SPGprints
4.6.14. Thieme Corporation
4.6.15. Thieme GmbH & Co KG
4.6.16. Ulano
4.6.17. UTZ Technologies
4.6.18. Werner Kammann Maschinenfabrik GmbH & Co. KG
 
5. INKJET PRINTING
5.1. Introduction
5.2. Suitability to different devices/ components
5.3. Existing uses
5.4. Future uses
5.4.1. Printed interconnects
5.4.2. Mass customization
5.4.3. OLED and flat panel displays, OLED lighting, Touch screens, OPV
5.4.4. Touch panel bezels
5.4.5. Masking followed by plating
5.4.6. PV bus bars and fingers
5.5. Company profiles
5.5.1. Ceradrop
5.5.2. Fujifilm Dimatix
5.5.3. Kateeva
5.5.4. Meyer Burger PixDro
5.5.5. Optomec
5.5.6. Samsung Electro-Mechanics
5.5.7. SCHMID Group
5.5.8. Seiko Epson
5.5.9. SIJ Technology
5.5.10. Sonoplot
5.5.11. THG Inkjet
5.5.12. Unijet
5.5.13. Xaar
 
6. FLEXO PRINTING
6.1. Introduction
6.2. Suitability to different devices/ components
6.3. Existing uses
6.4. Future uses
6.5. Company profiles
6.5.1. Gallus
6.5.2. Harper Corporation
6.5.3. Mark Andy
6.5.4. Multi Print Systems (MPS)
6.5.5. Nilpeter
6.5.6. Omet Varyflex
 
7. GRAVURE PRINTING
7.1. Introduction
7.2. Suitability to different devices/ components
7.3. Existing uses
7.4. Future uses
7.5. Company profiles
7.5.1. Bobst Group
7.5.2. Chestnut Engineering
7.5.3. Comco
7.5.4. Harper Corporation
7.5.5. Komori
7.5.6. Mirwec Film
7.5.7. Nilpeter
7.5.8. Ohio Gravure Technologies Accupress
 
8. OTHER PRINTING TYPES
8.1. Nano imprinting/embossing
8.1.1. Target applications
8.1.2. PragmatIC Printing
8.1.3. TNO
8.2. Transfer printing
8.2.1. Target applications
8.2.2. Semprius
 
9. COATING SYSTEMS: SLOT DIE AND ALTERNATIVES
9.1. Coating systems
9.2. Target Applications
9.3. Company profiles
9.3.1. Coatema
9.3.2. MegTec
9.3.3. Mitsubishi Materials Corporation
9.3.4. Ntact
 
10. POST PRINTING PROCESSING
10.1. Thermal drying
10.2. IR and UV curing
10.3. Photonic curing
10.4. Company profiles
10.4.1. Adphos
10.4.2. Heraeus Noblelight
10.4.3. Novacentrix
10.4.4. Xenon Corporation
 
11. EQUIPMENT INTEGRATION, HANDLING
11.1. Company profiles
11.1.1. 3D Micromac
11.1.2. Aixtron
11.1.3. Applied Laser Engineering ALE
11.1.4. Beneq
11.1.5. Bosch Rexroth
11.1.6. DP Patterning
11.1.7. InkTec
11.1.8. Kimoto Tech
11.1.9. Kroenert
11.1.10. Martin Automatic
11.1.11. Mekoprint A/S
11.1.12. Nordson Asymtek
11.1.13. Northfield Automation Systems
11.1.14. Notion Systems
11.1.15. Owens Design
11.1.16. Rolith, Inc.
11.1.17. Sempa Systems GmbH
11.1.18. Soligie
11.1.19. TDK-Lambda
11.1.20. Teknek Ltd.
11.1.21. VDL FLOW
11.1.22. Von Ardenne
11.1.23. Vinci Technologies
11.1.24. Werner Kammann Maschinenfabrik GmbH & Co. KG
11.1.25. Xymox
 
12. GOVERNMENT FUNDED CENTERS
12.1. Center profiles
12.1.1. Acreo, Sweden
12.1.2. CEA, France
12.1.3. Cetemmsa, Spain
12.1.4. CPI, UK
12.1.5. CSEM, Switzerland
12.1.6. Flexible Display Center, Arizona, USA
12.1.7. Holst Center (TNO, IMEC, Dutch Ministry of Economy Affairs, Government of Flanders), The Netherlands
12.1.8. ITRI, Taiwan
12.1.9. NRC
12.1.10. Printable Electronics Research Center, China
12.1.11. The Thailand Organic and Printed Electronics Center (TOPIC), Thailand
12.1.12. VTT
1.1. Displays 
1.2. Lighting 
1.3. Sensors 
1.4. PV 
1.5. Energy Storage 
1.6. Touch Screens 
1.7. Logic and Memory 
1.8. Other Components 
1.9. Leading providers of inkjet 
1.10. Leading providers of flexo, gravure and offset 
1.11. Leading providers of screen printing
1.12. Leading providers of coating 
1.13. Leading providers of photonic curing/sintering 
1.14. Leading providers of other 
2.1. Description and analysis of the main technology components of printed and potentially printed electronics 
2.2. Market value $ billions of only printed electronics 2013-2023 
2.3. Printing techniques with a physical master vs those without a physical master 
3.1. SWOT Analysis 
4.1. Key mechanical variables 
4.2. Output variables 
4.3. The strengths and weaknesses of screen printing 
5.1. Key variables 
5.2. Output characteristics 
5.3. The strengths and weaknesses of inkjet printing 
6.1. The strengths and weaknesses of inkjet printing 
7.1. Key variables 
7.2. Output characteristics 
7.3. The strengths and weaknesses of gravure printing 
1.1. The current market for printed, organic and flexible electronics in 2014 
1.2. Four main types of printed technologies being pursued for printed electronics 
1.3. Printed performance characteristics of the different printing types relevant to printed electronics 
1.4. Comparison of the different printing types by a number of running parameters 
1.5. Current status of printing by volume 
1.6. The value chain for equipment supply for printed electronics 
2.1. Market value $ billions of only printed electronics 2013-2023 
3.1. Example of a grid structure. 
3.2. Sheet resistance as a function of optical transmission for different materials. Metal grids have the best performance, i.e., sheet resistance of 10 Ohm at 95% transmission. 
3.3. Comparing the optical clarity of TCFs made using different materials/processes. It is noted that the directly printed metal mesh TCFs are not completely invisible and the naked eye can detect the grid structures. 
3.4. Players 
4.1. Screen printing is one of the oldest printing processes. It incorporates a frame (E), mesh (D), image (C), squeegee (B) and ink (A). 
4.2. Rotary screen printing wraps the mesh around a cylinder 
4.3. Two of the largest markets along with their needs
5.1. Ink jet technology 5.2. Printed interconnects 
5.3. Adaptive routing for board level packaging 
5.4. OLED/OPV encapsulation barriers, OPV/OLED lighting, signage and displays, touch screens 
5.5. Bezel (black matrix), conductive traces, spacers, bridges 
5.6. Less lateral growth during electroplating 
5.7. Size of ink droplet volume versus it's radius 
6.1. Flexo printed conductive lines. 
8.1. Transfer printed GaAs FETs on PET 
8.2. Semprius opportunity space 
9.1. A simplified schematic of a manufacturing process flow.
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