Home / Semiconductors / Printing Equipment for Printed Electronics 2015-2025

Printing Equipment for Printed Electronics 2015-2025

Published: Feb 2015 | No Of Pages: 223 | Published By: IDTechEx
This unique report addresses the applications and technologies of printing, curing and key integration equipment that is enabling printed electronics. The report assesses the performance of each printing and curing technology type, providing for each:
 
  • Assessment of capability and suitability to printing different types of materials 
  • Analysis of existing uses of the printing technology in printed electronics 
  • Trends and opportunities for the printing technologies 
  • Leading suppliers and company profiles  
 
This is assessed for the following printing and printed related manufacturing technologies:
 
  • Screen printing 
  • Inkjet printing 
  • Flexo printing (and offset) 
  • Gravure printing (and offset) 
  • Nano imprinting/embossing 
  • Transfer printing 
  • Coating systems (Slot die and alternatives)  
 
The following post-printing processes are also covered, including
 
  • Thermal drying 
  • IR and UV curing 
  • Photonic curing
 
In addition, we cover companies working on equipment integration, manufacturing centers and government funded printed electronics initiatives and manufacturing centers.
1. EXECUTIVE SUMMARY AND CONCLUSIONS 
1.1. Comparison of Printing Technologies 
1.1.1. Output performance comparison 
1.1.2. Running performance comparison 
1.1.3. Printing Type by Application 
1.1.4. Value chain for equipment for printed electronics 
1.1.5. Profitability 
1.1.6. Opportunities - Component Attach 
1.2. Forecasts by printing equipment type vs component 2015-2025
 
2. INTRODUCTION 
2.1. What is printed electronics 
2.2. Why printing? 
2.3. Types of Printed electronics technologies/components 
2.4. Market size of printed electronics 2015-2025 
2.5. Printing Technologies 
 
3. PRINTED ELECTRONICS MARKET 
3.1. Crystalline Silicon Photovoltaics 
3.2. Thin Film Photovoltaics 
3.3. Touch screens 
3.4. Logic and memory 
3.5. OLED displays and lighting 
3.6. Smart Packaging 
3.7. Transparent Conductive Films 
3.8. Direct Printing 
 
4. SCREEN PRINTING 
4.1. Introduction 
4.2. Screen printing forecasts 2015-2025 
4.3. Suitability to different devices/ components 
4.4. Existing uses 
4.5. Future uses 
4.6. Innovation and technical progress 
4.6.1. Resolution 
4.6.2. Print on print (Double print) 
4.7. Company profiles 
4.7.1. A&M Kinzel Siebdruckmaschinen Ltd 
4.7.2. Applied Materials Baccini 
4.7.3. Asada Mesh 
4.7.4. DEK Printing Machines Ltd 
4.7.5. Dynamesh 
4.7.6. Ever Bright Printing Machine Fty. Ltd 
4.7.7. KIWO 
4.7.8. Metal Etch Services Inc 
4.7.9. p-tec GmbH 
4.7.10. Saati Americas Corp 
4.7.11. Sefar 
4.7.12. Spartanics 
4.7.13. SPGprints 
4.7.14. Thieme Corporation 
4.7.15. Thieme GmbH & Co KG 
4.7.16. Ulano 
4.7.17. UTZ Technologies 
4.7.18. Werner Kammann Maschinenfabrik GmbH & Co. KG 
 
5. INKJET PRINTING 
5.1. Introduction 
5.2. Inkjet printing forecasts 2015-2025 
5.3. Suitability to different devices/ components 
5.4. Existing uses 
5.5. Future uses 
5.5.1. Printed interconnects 
5.5.2. Mass customization 
5.5.3. OLED and flat panel displays, OLED lighting, Touch screens, OPV 
5.5.4. Touch panel bezels 
5.5.5. Masking followed by plating 
5.5.6. PV bus bars and fingers 
5.6. Company profiles 
5.6.1. Ceradrop 
5.6.2. Fujifilm Dimatix 
5.6.3. Kateeva 
5.6.4. Meyer Burger PixDro
5.6.5. Optomec 
5.6.6. Samsung Electro-Mechanics
5.6.7. SCHMID Group 
5.6.8. Seiko Epson 
5.6.9. SIJ Technology 
5.6.10. Sonoplot 
5.6.11. THG Inkjet 
5.6.12. Unijet 
5.6.13. Xaar 
 
6. FLEXO PRINTING 
6.1. Introduction 
6.2. Flexo printing forecasts 2015-2025 
6.3. Suitability to different devices/ components 
6.4. Existing uses 
6.5. Future uses 
6.6. Company profiles 
6.6.1. Gallus 
6.6.2. Harper Corporation 
6.6.3. Mark Andy 
6.6.4. Multi Print Systems (MPS) 
6.6.5. Nilpeter 
6.6.6. Omet Varyflex 
 
7. GRAVURE PRINTING 
7.1. Introduction 
7.2. Gravure printing forecasts 2015-2025 
7.3. Suitability to different devices/ components 
7.4. Existing uses 
7.5. Future uses 
7.6. Company profiles 
7.6.1. Bobst Group 
7.6.2. Chestnut Engineering 
7.6.3. Comco 
7.6.4. Harper Corporation 
7.6.5. Komori 
7.6.6. Mirwec Film 
7.6.7. Nilpeter 
7.6.8. Ohio Gravure Technologies Accupress 
 
8. OTHER PRINTING TYPES 
8.1. Other printing forecasts 2015-2025 
8.2. Nano imprinting/embossing 
8.2.1. Target applications 
8.2.2. PragmatIC Printing 
8.2.3. TNO 
8.3. Transfer printing 
8.3.1. Target applications 
8.3.2. Semprius 
 
9. COATING SYSTEMS: SLOT DIE AND ALTERNATIVES 
9.1. Coating systems 
9.2. Target Applications 
9.3. Company profiles 
9.3.1. Coatema 
9.3.2. MegTec 
9.3.3. Mitsubishi Materials Corporation 
9.3.4. Ntact 
 
10. POST PRINTING PROCESSING 
10.1. Thermal drying 
10.2. IR and UV curing 
10.3. Photonic curing 
10.4. Company profiles 
10.4.1. Adphos 
10.4.2. Heraeus Noblelight 
10.4.3. Novacentrix 
10.4.4. Xenon Corporation 
 
11. EQUIPMENT INTEGRATION, HANDLING 
11.1. Company profiles 
11.1.1. 3D Micromac 
11.1.2. Aixtron 
11.1.3. Applied Laser Engineering ALE 
11.1.4. Beneq 
11.1.5. Bosch Rexroth 
11.1.6. DP Patterning 
11.1.7. InkTec 
11.1.8. Kimoto Tech 
11.1.9. Kroenert 
11.1.10. Martin Automatic 
11.1.11. Mekoprint A/S 
11.1.12. Nordson Asymtek 
11.1.13. Northfield Automation Systems 
11.1.14. Notion Systems 
11.1.15. Owens Design 
11.1.16. Rolith, Inc. 
11.1.17. Sempa Systems GmbH 
11.1.18. Soligie 
11.1.19. TDK-Lambda 
11.1.20. Teknek Ltd. 
11.1.21. VDL FLOW 
11.1.22. Von Ardenne 
11.1.23. Vinci Technologies 
11.1.24. Werner Kammann Maschinenfabrik GmbH & Co. KG 
11.1.25. Xymox 
 
12. GOVERNMENT FUNDED CENTERS 
12.1. Center profiles 
12.1.1. Acreo, Sweden 
12.1.2. CEA, France 
12.1.3. Cetemmsa, Spain 
12.1.4. CPI, UK 
12.1.5. CSEM, Switzerland 
12.1.6. Flexible Display Center, Arizona, USA 
12.1.7. Holst Center (TNO, IMEC, Dutch Ministry of Economy Affairs, Government of Flanders), The Netherlands 
12.1.8. ITRI, Taiwan 
12.1.9. NRC 
12.1.10. Printable Electronics Research Center, China 
12.1.11. The Thailand Organic and Printed Electronics Center (TOPIC), Thailand 
12.1.12. VTT IDTECHEX RESEARCH REPORTS IDTECHEX CONSULTANCY 
1.1. Displays 
1.2. Lighting 
1.3. Sensors
1.4. PV 
1.5. Energy Storage 
1.6. Touch Screens 
1.7. Logic and Memory 
1.8. Other Components 
1.9. Leading providers of inkjet 
1.10. Leading providers of flexo, gravure and offset 
1.11. Leading providers of screen printing 
1.12. Leading providers of coating
1.13. Leading providers of photonic curing/sintering 
1.14. Leading providers of other 
1.15. Logic/memory 
1.16. OLED Display 
1.17. OLED Light 
1.18. Electrophoretic/E-wetting/BiStable LCD 
1.19. Electrochromic 
1.20. Electroluminescent 
1.21. Battery 
1.22. Photovoltaics 
1.23. Sensors 
1.24. Conductors (ink only) 
2.1. Description and analysis of the main technology components of printed and potentially printed electronics 
2.2. Market value $ billions of only printed electronics 2015-2025
2.3. Printing techniques with a physical master vs those without a physical master 
3.1. SWOT Analysis 
4.1. Key mechanical variables 
4.2. Output variables 
4.3. Screen printing forecasts 2015-2025 
4.4. The strengths and weaknesses of screen printing 
5.1. Key variables 
5.2. Output characteristics 
5.3. Inkjet printing forecasts 2015-2025 
5.4. The strengths and weaknesses of inkjet printing 
6.1. Flexo printing forecasts 2015-2025 
6.2. The strengths and weaknesses of inkjet printing 
7.1. Key variables 
7.2. Output characteristics
7.3. Gravure printing forecasts 2015-2025 
7.4. The strengths and weaknesses of gravure printing 
8.1. Other printing forecasts 2015-2025 
1.1. The current market for printed, organic and flexible electronics 
1.2. Four main types of printed technologies being pursued for printed electronics 
1.3. Printed performance characteristics of the different printing types relevant to printed electronics 
1.4. Comparison of the different printing types by a number of running parameters 
1.5. Current status of printing by volume 
1.6. The value chain for equipment supply for printed electronics 
2.1. Market value $ billions of only printed electronics 2015-2025 
3.1. Example of a grid structure 
3.2. Sheet resistance as a function of optical transmission for different materials. Metal grids have the best performance, i.e., sheet resistance of 10 Ohm at 95% transmission.
3.3. Comparing the optical clarity of TCFs made using different materials/processes. It is noted that the directly printed metal mesh TCFs are not completely invisible and the naked eye can detect the grid structures. 
3.4. Players
4.1. Screen printing is one of the oldest printing processes. It incorporates a frame (E), mesh (D), image (C), squeegee (B) and ink (A). 
4.2. Rotary screen printing wraps the mesh around a cylinder 
4.3. Screen printing forecasts 2015-2025 
4.4. Two of the largest markets along with their needs 
5.1. Ink jet technology
5.2. Inkjet printing forecasts 2015-2025 
5.3. Printed interconnects 
5.4. Adaptive routing for board level packaging 
5.5. OLED/OPV encapsulation barriers, OPV/OLED lighting, signage and displays, touch screens 
5.6. Bezel (black matrix), conductive traces, spacers, bridges 
5.7. Less lateral growth during electroplating 
5.8. Size of ink droplet volume versus it's radius 
6.1. Flexo printing forecasts 2015-2025 
6.2. Flexo printed conductive lines. 
7.1. Gravure printing forecasts 2015-2025 
8.1. Other printing forecasts 2015-2025 
8.2. Transfer printed GaAs FETs on PET 
8.3. Semprius opportunity space 
9.1. A simplified schematic of a manufacturing process flow.
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